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  TennVac Inc. / Products / EMI Mold-In-Place Gasket

PFcan
(Pressure Formed Cover)

Pcan
(Pressure Gasketing Cover)

Clamshell
(Base Station Filter & Clamshell Cover)

 
       
 

/// Mold-In-Place Gasket

 
       
  Characteristics  
 
MIP is a two component, heat curable Silicone system, optimized for Over Molding or Mold-In-Place processes. Its high Electrical conductivity and very soft properties made it an excellent gasket for low pressure force application on Mobile devices for EMI Shielding and Environmental protection material purposes. It can be designed in various geometries to fit the harsh environment need.


 

 
   
 
 
  Features  
 
- Very soft Ag/Glass filled silicone
- High EMI shielding effectiveness
- Addition type silicone provides good electrical stability, no bleeding, no migration
 
   
 
 
  Applications  
 
- Mobile devices - PCMCIA card, CF card
- Medical devices
- Telecommunication devices
 
   
 
 
  Typical Properties  
 
Properites
Unit
M-1101
M-1102
M-1103
Elastomer Binder
Silicone
Silicone
Silicone
Conductive Filler
Ag/Glass
Ag/Glass, Ag/Cu
Ni/Gr
Physical Properties
Specific Gravity
g/cm3
2.0
2.0
2.0
Hardness
Shore A
60
60
60
Tensile Strength
PSI
200
200
150
Elongation
%
100
100
80
Tear Strength
lb/in
50
50
40
Compression Set
%
30
30
30
Color
Beige
Beige
Dark Grey
Temperature Range
degree C
-45 ~ 150
-45 ~ 150
-45 ~ 150
Max. using Temp.
degree C
200
200
200
Electrical Properties
Volume Resistivity
Ohm-cm
0.04
0.02
0.08
Field, 100 MHz
dB
100
100
100
Field, 500 MHz
dB
100
100
100
Field, 2 GHz
dB
100
100
100
 
 
 
 
 
     
   
 
 
   
 
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