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TennVac's unique Physical Vapor Deposition process provides an extremely low cost method of applying metals onto almost any substrate regardless of its sensitivity to heat. Our ability to selectively place materials, such as Copper, in the location and thickness required, is well suited to high volume low cost applications.
Because the antenna process is done in an air free environment, we are able to apply multiple metal layers in a single application, without any concern of oxidation to the inner layers. This allows us to determine location, thickness and types of metals used based on the requirements of the antenna, not the constraints of the process. This also provides our customers with the ability to utilize a highly conductive metal for an inner layer in combination with a more rugged outer layer that can be soldered to such as Tin.
Max¡VAntenna also allows RF Engineers total freedom to place the antenna in the location that provides maximum performance for the least amount of cost. Max¡VAntenna can be placed directly to a plastic housing, onto Mylar film or on a stand alone substrate. Other performance benefits can be seen by utilizing 3 dimensional design techniques to enhance signal integrity no matter the physical placement of the device.
Whether your goal is increased performance, more flexibility or lower total costs, TennMax has the solution for your antenna needs. |
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